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FDS4141-F085 - onsemi

Description: P-Channel 40 V 10.8A (Ta) 1.6W (Ta) Surface Mount 8-SOIC

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FDS4141-F085 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8 CASE 751EB ISSUE A
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FDS4141-F085 - onsemi  - 3D model - Small Outline Packages - SOIC8 CASE 751EB ISSUE A
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FDS4141-F085 Details

  • Manufacturer Part Number:

    FDS4141-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SO 8L NB

  • Package Description:

    SOP-8

  • Manufacturer Package Code:

    751EB

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    229 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    10.8 A

  • Drain-source On Resistance-Max:

    0.013 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.6 W

  • Pulsed Drain Current-Max (IDM):

    36 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDS4141-F085 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.
  • Ensure that the input voltage (VIN) is within the recommended range (4.5V to 5.5V) and the output voltage (VOUT) is set to the desired value using the feedback resistors (RFBT and RFBG). Also, ensure that the input and output capacitors are properly selected and placed close to the device.
  • The maximum output current capability of the FDS4141-F085 is 4A. However, the actual output current capability may be limited by the thermal performance of the PCB and the device's thermal resistance.
  • Use an overvoltage protection (OVP) circuit and an undervoltage lockout (UVLO) circuit to protect the device from voltage transients and faults. The OVP circuit should be designed to trigger at a voltage higher than the maximum recommended input voltage, and the UVLO circuit should be designed to trigger at a voltage lower than the minimum recommended input voltage.
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 10uF to 22uF is recommended for the input capacitor. This helps to filter out high-frequency noise and ensure stable operation.

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FDS4141-F085 Overview

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