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FDS5351 - onsemi

Description: Max rDS(on) = 35mΩ at VGS = 10V, ID = 6.1A; RoHS Compliant; High performance trench technology for extremely low rDS(on); Max rDS(on) = 42mΩ at VGS = 4.5V, ID = 5.5A; 100% UIL Tested

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FDS5351 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8 CASE 751EB ISSUE A_3
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FDS5351 - onsemi  - 3D model - Small Outline Packages - SOIC8 CASE 751EB ISSUE A_3
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FDS5351 Details

  • Manufacturer Part Number:

    FDS5351

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOP-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    73 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    6.1 A

  • Drain-source On Resistance-Max:

    0.035 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    5 W

  • Pulsed Drain Current-Max (IDM):

    30 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDS5351 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDS5351 involves keeping the high-current paths short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a shielded inductor and to keep the switching node (SW) away from sensitive analog circuits.
  • To optimize the FDS5351 for low standby power consumption, ensure that the EN pin is properly biased to turn off the device when not in use. Also, select a low-ESR input capacitor and a high-efficiency inductor to minimize power losses. Furthermore, consider using a low-voltage, low-power mode for the controller IC.
  • The maximum allowed voltage on the VIN pin of the FDS5351 is 28V. Exceeding this voltage may damage the device. It's recommended to use a voltage regulator or a transient voltage suppressor to protect the device from voltage spikes.
  • To troubleshoot the FDS5351 if it's not switching properly, first check the input voltage and ensure it's within the recommended range. Then, verify that the EN pin is properly biased and that the FB pin is not shorted to GND. Also, check the inductor and capacitor values to ensure they are within the recommended range. Finally, use an oscilloscope to check the switching node (SW) waveform for any anomalies.
  • The FDS5351 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to use a heat sink or a thermal interface material to keep the device temperature below 100°C. Additionally, ensure that the device is properly derated for high-temperature operation.

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FDS5351 Overview

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