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FDS5680 - onsemi

Description: Obsolete - 60V N-Channel PowerTrench MOSFET 7A, 28mΩ

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FDS5680 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC 8_2021
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FDS5680 - onsemi  - 3D model - Small Outline Packages - SOIC 8_2021
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FDS5680 Details

  • Manufacturer Part Number:

    FDS5680

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOP-8

  • Manufacturer Package Code:

    751EB

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    8 A

  • Drain-source On Resistance-Max:

    0.02 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    100 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.5 W

  • Pulsed Drain Current-Max (IDM):

    50 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    76 ns

  • Turn-on Time-Max (ton):

    40 ns

FDS5680 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDS5680 involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, using a shielded inductor and placing it close to the device can help reduce EMI.
  • To ensure the FDS5680 operates within its SOA, monitor the device's junction temperature, input voltage, and output current. Make sure the device is not exposed to excessive temperatures, and the input voltage and output current are within the recommended operating ranges.
  • The recommended input capacitor value for the FDS5680 is 10uF to 22uF, with a voltage rating of 25V or higher. A low-ESR ceramic capacitor, such as an X5R or X7R type, is recommended for optimal performance.
  • To optimize the FDS5680's output voltage accuracy, use a high-precision resistor divider network for the feedback resistors, and ensure the output voltage is measured directly at the output pin. Additionally, minimize the noise and ripple on the input voltage and output voltage lines.
  • The recommended thermal management strategy for the FDS5680 involves using a heat sink with a thermal resistance of 10°C/W or lower, and applying a thermal interface material (TIM) with a thermal conductivity of 1 W/m-K or higher. Ensure good airflow around the device and heat sink.

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FDS5680 Overview

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