Terminus recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A heat sink or thermal pad can also be used to improve thermal performance.
Use a low-ESR capacitor (e.g., 10uF) close to the device's power pins, and ensure the power supply can provide a stable 1.8V or 3.3V output with minimal ripple (<100mV).
The FE1.1 can achieve up to 100Mbps data transfer rate. To achieve this, use a high-speed PCB design, ensure signal integrity, and optimize the firmware to minimize latency and maximize throughput.
Use a secure boot mechanism, implement a firmware update protocol (e.g., UART or SPI), and ensure the update process is atomic and failsafe to prevent bricking the device.
Use a logic analyzer or oscilloscope to monitor signals, implement debug logs and error handling in firmware, and use a JTAG or SWD interface for low-level debugging.
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FE1.1 Overview
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