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FEMC004GSTE9-T14-17 - Flexxon

Description: FLASH - NAND (pSLC) Memory IC 32Gbit eMMC_5.1 200 MHz 153-FBGA (11.5x13), 2.7V ~ 3.6V , 200 MHz , -40°C ~ 85°C (TA)

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Symbol

FEMC004GSTE9-T14-17 - Flexxon - PCB symbol

PCB Footprints

FEMC004GSTE9-T14-17 - Flexxon PCB footprint - BGA - BGA - 153 FBGA

3D Models

FEMC004GSTE9-T14-17 - Flexxon - 3D model - BGA - 153 FBGA

Datasheet Download Datasheet
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Part Number FEMC004GSTE9-T14-17
Manufacturer Flexxon
Pin Count 153
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 153 FBGA
Released Date Jan 4, 2026
Last Modified Date Jan 4, 2026 7:19 AM UTC
Pinout / Pin List Click Here (Member Only)

FEMC004GSTE9-T14-17 Details

Manufacturer Part Number:
FEMC004GSTE9-T14-17
Manufacturer:
Flexxon Pte Ltd

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