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FERD20L60CG-TR - STMicroelectronics

Description: STMICROELECTRONICS - FERD20L60CG-TR - RECTIFIER, DUAL, 60V, 20A, TO-263-3

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FERD20L60CG-TR - STMicroelectronics - PCB symbol
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PCB Footprints
FERD20L60CG-TR - STMicroelectronics PCB footprint - Other - Other - ST_D2PAK
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3D Models
FERD20L60CG-TR - STMicroelectronics - 3D model - Other - ST_D2PAK
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FERD20L60CG-TR Details

  • Manufacturer Part Number:

    FERD20L60CG-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    D2PAK-3/2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.98

  • Additional Feature:

    LOW FORWARD VOLTAGE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.535 V

  • JESD-30 Code:

    R-PSSO-G2

  • Non-rep Pk Forward Current-Max:

    140 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    970 µA

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

FERD20L60CG-TR Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a 2-layer PCB with a thermal pad connected to a large copper area on the bottom layer for efficient heat dissipation.
  • Implement a proper thermal management system, ensure good airflow, and consider using a heat sink or thermal interface material to maintain a safe junction temperature (Tj) below 150°C.
  • Use a gate driver with a high current capability (>1A) and a low output impedance to ensure fast switching times and minimize power losses. A dedicated gate driver IC or a discrete circuit with a low-ESR capacitor can be used.
  • Implement overvoltage protection (OVP) and overcurrent protection (OCP) circuits using zener diodes, TVS diodes, or dedicated ICs. Ensure the protection circuits can respond quickly to fault conditions and are designed to handle the maximum expected voltage and current.
  • Use ESD protection devices such as TVS diodes or ESD arrays at the input and output pins. Ensure the PCB layout minimizes signal trace lengths and uses a ground plane to reduce ESD susceptibility.

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FERD20L60CG-TR Overview

Use the download button to access the FERD20L60CG-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like FERD2, or try a keyword search, such as Rectifier Diodes

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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