FERD30L60CG-TR footprint, schematic symbol and 3D model by STMicroelectronics

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PCB Footprints

FERD30L60CG-TR - STMicroelectronics PCB footprint - Other - Other - FERD30L60CG-TR-1

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Datasheet Download Datasheet
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Part Number FERD30L60CG-TR
Manufacturer STMicroelectronics
Pin Count 3
Part Category Diode with Dual Anode
Package Category Other
Footprint Name Other - FERD30L60CG-TR-1
Released Date Sep 1, 2022
Last Modified Date Jan 8, 2026 2:31 PM UTC
Pinout / Pin List Click Here (Member Only)

FERD30L60CG-TR Details

Manufacturer Part Number:
FERD30L60CG-TR
Brand Name:
STMicroelectronics
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
D2PAK-3/2
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Factory Lead Time:
15 Weeks
Manufacturer:
STMicroelectronics
YTEOL:
5.98
Application:
EFFICIENCY
Case Connection:
CATHODE
Configuration:
COMMON CATHODE, 2 ELEMENTS
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
0.545 V
JESD-30 Code:
R-PSSO-G2
Non-rep Pk Forward Current-Max:
250 A
Number of Elements:
2
Number of Phases:
1
Number of Terminals:
2
Operating Temperature-Max:
150 °C
Output Current-Max:
15 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Rep Pk Reverse Voltage-Max:
60 V
Reverse Current-Max:
820 µA
Reverse Test Voltage:
60 V
Surface Mount:
YES
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED

FERD30L60CG-TR Frequently Asked Questions (FAQs)

STMicroelectronics provides a recommended PCB layout in their application note AN5046, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
The FERD30L60CG-TR requires a specific biasing scheme to operate within its recommended operating conditions. Refer to the application note AN5046 and the datasheet for guidance on setting the correct bias voltage and current levels.
STMicroelectronics recommends using a gate drive circuit with a low impedance output stage and a high current capability to ensure fast switching times and minimize ringing. A suitable gate drive circuit is described in the application note AN5046.
Implementing overvoltage protection (OVP) and overcurrent protection (OCP) circuits is crucial to prevent damage to the FERD30L60CG-TR. STMicroelectronics provides guidelines for designing OVP and OCP circuits in their application notes and datasheets.
The FERD30L60CG-TR has a high power density, so thermal management is critical. Ensure good heat sinking, use thermal interface materials, and consider forced air cooling or liquid cooling for high-power applications.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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