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FERD30M45CT - STMicroelectronics

Description: 45V, 30 A dual Field-Effect Rectifier Diode (FERD)

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PCB Footprints
FERD30M45CT - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - 0TO-220AB_(Height=4.6mm)
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3D Models
FERD30M45CT - STMicroelectronics  - 3D model - Transistor Outline, Vertical - 0TO-220AB_(Height=4.6mm)
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FERD30M45CT Details

  • Manufacturer Part Number:

    FERD30M45CT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.7

  • Application:

    GENERAL PURPOSE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.47 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Non-rep Pk Forward Current-Max:

    250 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Reverse Current-Max:

    600 µA

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

FERD30M45CT Frequently Asked Questions (FAQs)

  • A good PCB layout for FERD30M45CT should include a large copper area for heat dissipation, with multiple vias connecting the top and bottom layers. A thermal pad on the bottom of the package should be connected to a large copper area on the PCB.
  • To ensure reliable operation at high temperatures, ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout. Also, consider derating the device's current and voltage ratings according to the temperature derating curve provided in the datasheet.
  • The FERD30M45CT has an integrated ESD protection circuit, but it's still recommended to follow proper ESD handling procedures during assembly and storage. Use an ESD wrist strap or mat, and ensure that the device is stored in an anti-static bag or container.
  • Yes, the FERD30M45CT is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and ensure that the device is properly qualified and validated for the specific application.
  • Follow the recommended soldering temperature profile and assembly procedures outlined in the datasheet. Use a solder with a melting point above 217°C, and ensure that the device is properly cleaned and dried before assembly.

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FERD30M45CT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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