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FERD30SM100DJFTR - STMicroelectronics

Description: Diode FERD (Field Effect Rectifier Diode) 100 V 30A Surface Mount PowerFlat™ (5x6)

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PCB Footprints
FERD30SM100DJFTR - STMicroelectronics PCB footprint - Other - Other - PowerFLAT™ 5x6_2022
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3D Models
FERD30SM100DJFTR - STMicroelectronics  - 3D model - Other - PowerFLAT™ 5x6_2022
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FERD30SM100DJFTR Details

  • Manufacturer Part Number:

    FERD30SM100DJFTR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Manufacturer Package Code:

    PowerFLAT 5x6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.38

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.97 V

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    180 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    150 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

FERD30SM100DJFTR Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a 2-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently.
  • Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature below 150°C. Also, ensure proper PCB design and layout to minimize thermal resistance.
  • STMicroelectronics recommends a peak reflow temperature of 260°C, with a soldering time of 10-30 seconds. Use a solder with a melting point above 217°C to ensure reliable joints.
  • Use ESD-protective packaging, wrist straps, and mats during handling and assembly. Ground all equipment and personnel to prevent static discharge.
  • Store the FERD30SM100DJFTR in a dry, cool place (below 30°C and 60% RH) away from direct sunlight and moisture. Use anti-static packaging and follow ESD precautions.

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FERD30SM100DJFTR Overview

Use the download button to access the FERD30SM100DJFTR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like FERD3, or try a keyword search, such as Rectifier Diodes

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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