FF45MR12W1M1B11BOMA1 footprint, schematic symbol and 3D model by Infineon

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FF45MR12W1M1B11BOMA1 - Infineon PCB footprint - Other - Other - FF45MR12W1M1B11BOMA1-4

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Datasheet Download Datasheet
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Part Number FF45MR12W1M1B11BOMA1
Manufacturer Infineon
Pin Count 10
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - FF45MR12W1M1B11BOMA1-4
Released Date Mar 6, 2023
Last Modified Date Dec 4, 2025 3:29 AM UTC
Pinout / Pin List Click Here (Member Only)

FF45MR12W1M1B11BOMA1 Details

Manufacturer Part Number:
FF45MR12W1M1B11BOMA1
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Package Description:
MODULE-10
ECCN Code:
EAR99
Factory Lead Time:
4 Weeks
Manufacturer:
Infineon Technologies AG
YTEOL:
0
Case Connection:
ISOLATED
Configuration:
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR
DS Breakdown Voltage-Min:
1200 V
Drain-source On Resistance-Max:
0.045 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss):
14 pF
Gate-Emitter Thr Voltage-Max:
20 V
JESD-30 Code:
R-XUFM-X10
Number of Elements:
2
Number of Terminals:
10
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
UNSPECIFIED
Package Shape:
RECTANGULAR
Package Style:
FLANGE MOUNT
Polarity/Channel Type:
N-Channel
Pulsed Drain Current-Max (IDM):
50 A
Surface Mount:
NO
Terminal Form:
UNSPECIFIED
Terminal Position:
UPPER
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
Turn-off Time-Nom (toff):
55300 ns
Turn-on Time-Nom (ton):
14100 ns
VCEsat-Max:
5.55 V

FF45MR12W1M1B11BOMA1 Frequently Asked Questions (FAQs)

The thermal resistance (Rth) of the FF45MR12W1M1B11BOMA1 is typically around 1.5 K/W (junction-to-case) and 3.5 K/W (junction-to-ambient) when mounted on a standard PCB.
The FF45MR12W1M1B11BOMA1 is rated for operation up to 150°C (Tj), but it's recommended to derate the power dissipation above 125°C to ensure reliable operation and prevent thermal runaway.
To ensure reliability in high-humidity environments, it's essential to follow proper storage and handling procedures, and to apply a conformal coating to the device. Additionally, consider using a moisture-sensing device or a humidity-controlled storage environment.
Infineon provides a recommended PCB layout and thermal design guide in the application note AN2014-01. It's essential to follow these guidelines to ensure optimal thermal performance and to prevent thermal hotspots.
The FF45MR12W1M1B11BOMA1 is rated for a maximum voltage of 650V. While it can be used in high-voltage applications, it's crucial to ensure that the device is properly snubbed and that the voltage rating is not exceeded to prevent damage or failure.

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FF45MR12W1M1B11BOMA1 Overview

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