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FFB20UP20DN-F085 - onsemi

Description: High Reverse Voltage : VRRM = 200V; Avalanche Energy Rated; Planar Construction

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PCB Footprints
FFB20UP20DN-F085 - onsemi PCB footprint - Other - Other - TO-263
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FFB20UP20DN-F085 - onsemi  - 3D model - Other - TO-263
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FFB20UP20DN-F085 Details

  • Manufacturer Part Number:

    FFB20UP20DN-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-263 2L (D2PAK)

  • Package Description:

    D2PAK-3

  • Manufacturer Package Code:

    418AJ

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.55

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    HYPER ULTRA FAST RECOVERY

  • Breakdown Voltage-Min:

    200 V

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.04 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

FFB20UP20DN-F085 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an inner layer or the backside of the PCB for better heat dissipation.
  • The device requires a stable input voltage and a proper biasing circuit to ensure optimal performance. A voltage regulator can be used to regulate the input voltage, and a bias resistor can be used to set the operating point of the device.
  • The device is sensitive to electrostatic discharge (ESD) and can be damaged by excessive voltage or current. Handle the device with an ESD wrist strap or mat, and avoid touching the pins or leads. Use a soldering iron with a temperature-controlled tip to prevent overheating.
  • Use a logic analyzer or oscilloscope to monitor the input and output signals of the device. Check the power supply voltage and current, and ensure that the device is properly biased. Consult the datasheet and application notes for troubleshooting guidelines.
  • The PCB material should have a high thermal conductivity to dissipate heat effectively. A thick copper layer (e.g., 2 oz) and a high-Tg FR4 material are recommended. Avoid using PCB materials with high thermal resistance, such as FR2 or FR3.

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FFB20UP20DN-F085 Overview

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Part Image FFB20UP20DN_F085 onsemi

Rectifier Diode, Avalanche, 1 Phase, 2 Element, 10A, 200V V(RRM), Silicon, TO-263AB