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FFB20UP30DNTM - onsemi

Description: Ultrafast recovery, Trr = 45ns (@IF= 10A); Avalanche Energy Rated; RoHS compliant; Reverse Voltage : VRRM = 300V; Max Forward Voltage, VF = 1.3V (@ TC = 25°C)

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FFB20UP30DNTM Details

  • Manufacturer Part Number:

    FFB20UP30DNTM

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    D2PAK-3 / TO-263-2

  • Package Description:

    D2PAK-3

  • Manufacturer Package Code:

    418AJ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    ULTRA FAST RECOVERY POWER

  • Breakdown Voltage-Min:

    300 V

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    180 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    300 V

  • Reverse Current-Max:

    1 µA

  • Reverse Recovery Time-Max:

    0.045 µs

  • Reverse Test Voltage:

    300 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

FFB20UP30DNTM Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are recommended for optimal thermal performance.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement proper thermal management, such as heat sinks or thermal interfaces, to maintain a safe operating temperature.
  • The FFB20UP30DNTM has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures during assembly and testing to prevent damage.
  • Yes, the FFB20UP30DNTM is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards.
  • The optimal gate resistor value depends on the specific application and switching frequency. A general guideline is to start with a value between 10Ω to 100Ω and adjust based on the device's switching characteristics and losses.

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FFB20UP30DNTM Overview

Use the download button to access the FFB20UP30DNTM 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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