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FFH75H60S - onsemi

Description: Max Forward Voltage, VF = 1.8V (@ TC = 25°C); 600V Reverse Voltage and High Reliability; RoHS compliant; Avalanche Energy Rated; Hyperfast recovery Trr = 75ns (@IF= 75A)

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PCB Footprints
FFH75H60S - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO−247−2LD CASE 340CL ISSUE A
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3D Models
FFH75H60S - onsemi  - 3D model - Transistor Outline, Vertical - TO−247−2LD CASE 340CL ISSUE A
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FFH75H60S Details

  • Manufacturer Part Number:

    FFH75H60S

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-247-2

  • Package Description:

    TO-247AB, 3/2 PIN

  • Manufacturer Package Code:

    340CL

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE, HIGH RELIABILITY

  • Application:

    HYPER ULTRA FAST SOFT RECOVERY

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.2 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    750 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    75 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    100 µA

  • Reverse Recovery Time-Max:

    0.075 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

FFH75H60S Frequently Asked Questions (FAQs)

  • The maximum SOA for the FFH75H60S is not explicitly stated in the datasheet, but it can be estimated using the device's thermal resistance, power dissipation, and voltage ratings. A safe operating area can be determined by consulting the device's thermal derating curve and ensuring that the device operates within the recommended temperature range.
  • To ensure proper cooling, consider the device's thermal resistance, power dissipation, and maximum junction temperature. Use a heat sink with a thermal resistance of 1°C/W or lower, and ensure good thermal contact between the device and heat sink. Additionally, consider using a thermal interface material and ensuring good airflow around the heat sink.
  • The recommended gate drive voltage for the FFH75H60S is between 10V and 15V. A higher gate drive voltage can reduce the device's on-state resistance, but may also increase switching losses. Consult the device's datasheet and application notes for more information on gate drive requirements.
  • To minimize EMI, use a layout with short, direct traces, and consider using a ground plane to reduce radiation. Use a common-mode choke or ferrite bead to filter high-frequency noise, and ensure that the device's switching node is properly decoupled. Additionally, consider using a shielded enclosure or metal casing to contain EMI.
  • The maximum allowed dv/dt for the FFH75H60S is not explicitly stated in the datasheet, but it is typically recommended to limit dv/dt to 1000V/μs or less to prevent voltage overshoot and ensure reliable operation. Consult the device's application notes and datasheet for more information on dv/dt limitations.

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