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FFPF10UP60STU - onsemi

Description: Last Shipments - 15A, 600V, STEALTH II Diode

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PCB Footprints
FFPF10UP60STU - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220 FULLPACK,2-LEAD/TO-220F-2FS-1
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3D Models
FFPF10UP60STU - onsemi  - 3D model - Transistor Outline, Vertical - TO-220 FULLPACK,2-LEAD/TO-220F-2FS-1
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FFPF10UP60STU Details

  • Manufacturer Part Number:

    FFPF10UP60STU

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220 FP / TO-220F-2FS

  • Package Description:

    TO-220F-2L, 2 PIN

  • Manufacturer Package Code:

    221AS

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    ULTRA FAST SOFT RECOVERY

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    100 µA

  • Reverse Recovery Time-Max:

    0.04 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

FFPF10UP60STU Frequently Asked Questions (FAQs)

  • A 2-layer PCB with a thermal relief pattern on the bottom layer and a solid copper pour on the top layer is recommended. Ensure a minimum of 1 oz copper thickness and a 1-inch square copper area for heat sinking.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended PCB layout. Also, consider derating the device's current rating at high temperatures.
  • The maximum allowed voltage transient is 60V, but it's recommended to limit it to 50V to ensure reliable operation and prevent damage to the device.
  • Yes, the FFPF10UP60STU is suitable for switching applications. However, ensure that the switching frequency is within the recommended range (typically up to 100 kHz) and that the device is properly snubbed to prevent voltage spikes.
  • Use ESD protection devices, such as TVS diodes or ESD suppressors, on the input and output pins. Ensure that the PCB design includes ESD protection features, such as a Faraday cage or ESD shielding.

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FFPF10UP60STU Overview

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Part Image FFPF10UP60STU Fairchild Semiconductor Corporation

Rectifier Diode, 1 Phase, 1 Element, 10A, 600V V(RRM), Silicon, TO-220AC