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FFPF30UP20STU - onsemi

Description: Last Shipments - Silicon Carbide (SiC) Schottky Diode, 650 V, 4 A, D2PAK

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Symbol
FFPF30UP20STU - onsemi - PCB symbol
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PCB Footprints
FFPF30UP20STU - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO−220 Fullpack, 2−Lead / TO−220F−2FS CASE 221AS ISSUE O
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3D Models
FFPF30UP20STU - onsemi - 3D model - Transistor Outline, Vertical - TO−220 Fullpack, 2−Lead / TO−220F−2FS CASE 221AS ISSUE O
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FFPF30UP20STU Details

  • Manufacturer Part Number:

    FFPF30UP20STU

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220 FP / TO-220F-2FS

  • Package Description:

    TO-220F, 2 PIN

  • Manufacturer Package Code:

    221AS

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    ULTRA FAST SOFT RECOVERY POWER

  • Breakdown Voltage-Min:

    200 V

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    300 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    100 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

FFPF30UP20STU Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for FFPF30UP20STU is a thermal pad with a minimum size of 2.5mm x 2.5mm, with a 1.5mm diameter thermal via connecting to a larger copper area on the bottom layer for heat dissipation.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the thermal pad. Use a soldering technique that minimizes the time the iron is in contact with the component.
  • The maximum allowed voltage on the gate of FFPF30UP20STU is 20V, as specified in the datasheet. Exceeding this voltage may damage the component.
  • Yes, FFPF30UP20STU is suitable for high-frequency switching applications up to 100 kHz. However, ensure that the PCB layout and component selection are optimized for high-frequency operation to minimize losses and ringing.
  • To calculate the power dissipation of FFPF30UP20STU, use the equation Pd = (Vds x Ids) + (Vgs x Igs), where Vds is the drain-source voltage, Ids is the drain-source current, Vgs is the gate-source voltage, and Igs is the gate-source current. Consult the datasheet for the component's thermal resistance and maximum junction temperature to ensure safe operation.

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FFPF30UP20STU Overview

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