FFSB10120A footprint, schematic symbol and 3D model by onsemi

Symbol

click to zoom

PCB Footprints

FFSB10120A - onsemi PCB footprint - Other - Other - D2PAK2 (TO−263−2L)

click to zoom

Datasheet Download Datasheet
Stock & Prices Price & Stock for FFSB10120A
Part Number FFSB10120A
Manufacturer onsemi
Pin Count 3
Part Category Diode
Package Category Other
Footprint Name Other - D2PAK2 (TO−263−2L)
Released Date Oct 3, 2022
Last Modified Date Jan 22, 2025 4:53 PM UTC
Pinout / Pin List Click Here (Member Only)

FFSB10120A Details

Manufacturer Part Number:
FFSB10120A
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
D2PAK2 (TO-263-2L)
Package Description:
TO-263, D2PAK-3/2
Manufacturer Package Code:
418BK
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Manufacturer:
onsemi
YTEOL:
6.75
Additional Feature:
HIGH RELIABILITY, PD-CASE
Application:
EFFICIENCY
Case Connection:
CATHODE
Configuration:
SINGLE
Diode Element Material:
SILICON CARBIDE
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
1.75 V
JEDEC-95 Code:
TO-263AB
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
90 A
Number of Elements:
1
Number of Phases:
1
Number of Terminals:
2
Operating Temperature-Max:
175 °C
Operating Temperature-Min:
-55 °C
Output Current-Max:
21 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Power Dissipation-Max:
283 W
Rep Pk Reverse Voltage-Max:
1200 V
Reverse Current-Max:
200 µA
Reverse Test Voltage:
1200 V
Surface Mount:
YES
Technology:
SCHOTTKY
Terminal Finish:
MATTE TIN
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30

FFSB10120A Frequently Asked Questions (FAQs)

The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum size of 20mm x 20mm, and using multiple vias to connect the thermal pad to the ground plane. This helps to dissipate heat efficiently and reduce thermal resistance.
To ensure reliable operation at high temperatures, it is recommended to follow the derating guidelines provided in the datasheet, and to ensure that the device is operated within the specified maximum junction temperature (Tj) of 150°C. Additionally, proper thermal design and heat sinking can help to reduce the junction temperature and ensure reliable operation.
The recommended gate drive voltage for optimal switching performance is between 10V and 15V. This ensures that the device is fully enhanced and switches quickly, resulting in low switching losses and high efficiency.
To prevent shoot-through current during switching transitions, it is recommended to use a dead-time control circuit to ensure that the high-side and low-side devices are not turned on simultaneously. Additionally, using a gate drive circuit with a high dv/dt capability can help to reduce the risk of shoot-through current.
To minimize EMI and RFI, it is recommended to follow good PCB layout practices, such as keeping the power stage components close together, using a solid ground plane, and minimizing the length of high-frequency traces. Additionally, using shielding and filtering components, such as ferrite beads and capacitors, can help to reduce EMI and RFI emissions.

Trust Checks

Manufacturer Collaborated

System Verified

Community Approved

FFSB10120A Overview

Use the download button to access the FFSB10120A schematic symbol and PCB footprint.

To find more CAD model downloads similar to this part, try a partial part number search, like FFSB1, or try a keyword search, such as Rectifier Diodes

Parts related to FFSB10120A

Showing 0 results