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FFSB1065B - onsemi

Description: Max Junction Temperature 175 °C; Avalanche Rated 49 mJ; High Surge Current Capacity; Positive Temperature Coefficient; No Reverse Recovery / No Forward Recovery; Low Vf @ TJ:175 °C

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Symbol
FFSB1065B - onsemi - PCB symbol
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PCB Footprints
FFSB1065B - onsemi PCB footprint - Other - Other - D2PAK−3 (TO−263, 3−LEAD) CASE 418AJ ISSUE C
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3D Models
FFSB1065B - onsemi - 3D model - Other - D2PAK−3 (TO−263, 3−LEAD) CASE 418AJ ISSUE C
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FFSB1065B Details

  • Manufacturer Part Number:

    FFSB1065B

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK2 (TO-263-2L)

  • Manufacturer Package Code:

    418BK

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.62

  • Additional Feature:

    HIGH RELIABILITY, PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    45 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    27 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    79 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    40 µA

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

FFSB1065B Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, using a minimum of 2 oz copper thickness, and ensuring a solid ground plane on the top and bottom layers. Additionally, it's recommended to use vias to connect the thermal pad to the ground plane.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, ensure proper heat sinking, and avoid exceeding the maximum junction temperature (Tj) of 150°C. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, it's recommended to operate the device within the recommended operating conditions, which specify a maximum input voltage of 5V.
  • The FFSB1065B has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. This includes using an ESD wrist strap, ESD mat, or ESD bag to prevent static damage.
  • The recommended storage temperature range for the FFSB1065B is -40°C to 125°C, and the recommended storage humidity range is 20% to 80% relative humidity. It's essential to follow these guidelines to prevent damage to the device during storage.

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FFSB1065B Overview

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FFSB1065B Alternates

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Part Image FFSB1065B-F085 onsemi

Rectifier Diode, Schottky, 1 Phase, 1 Element, 27A, 650V V(RRM), Silicon Carbide, TO-263AB