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FFSD2065B - onsemi

Description: Low Vf @ TJ:175 °C; Max Junction Temperature 175°C; Avalanche Rated 94 mJ; High Surge Current Capacity; Positive Temperature Coefficient; No Reverse Recovery / No Forward Recovery

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PCB Footprints
FFSD2065B - onsemi PCB footprint - Other - Other - FFSD2065B-1
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3D Models
FFSD2065B - onsemi  - 3D model - Other - FFSD2065B-1
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FFSD2065B Details

  • Manufacturer Part Number:

    FFSD2065B

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DPAK-3 / TO-252-3

  • Manufacturer Package Code:

    369AS

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    6 Weeks

  • Date Of Intro:

    2020-01-30

  • Manufacturer:

    onsemi

  • YTEOL:

    6.62

  • Additional Feature:

    HIGH RELIABILITY, PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    80 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    23.4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    160 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    40 µA

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

FFSD2065B Frequently Asked Questions (FAQs)

  • A good PCB layout for the FFSD2065B should include a solid copper plane on the bottom layer for heat dissipation, and a thermal relief pattern around the drain pad to prevent thermal gradients. Additionally, keeping the drain and source pins as close as possible to the PCB can help reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for the device, and to ensure good thermal management through proper PCB design and heat sinking. Additionally, consider using a thermal interface material (TIM) between the device and the heat sink to reduce thermal resistance.
  • While the datasheet specifies a maximum gate-source voltage of ±20V, it's recommended to limit the voltage to ±15V to ensure reliable operation and prevent damage to the device.
  • To protect the FFSD2065B from ESD, use proper handling and storage procedures, such as using anti-static bags and wrist straps. Additionally, consider adding ESD protection devices, such as TVS diodes or ESD arrays, to the PCB design.
  • The recommended gate drive voltage is typically between 10V to 15V, and the current should be limited to 1A to 2A to prevent excessive power dissipation in the gate driver. However, the specific requirements may vary depending on the application and switching frequency.

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FFSD2065B Overview

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