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FFSH10120A - onsemi

Description: Max Junction Temperature 175 °C; Avalanche Rated 100 mJ; High Surge Current Capacity; Positive Temperature Coefficient; No Reverse Recovery / No Forward Recovery

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Symbol
FFSH10120A - onsemi - PCB symbol
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PCB Footprints
FFSH10120A - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO−247−2LD CASE 340CL ISSUE A
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3D Models
FFSH10120A - onsemi - 3D model - Transistor Outline, Vertical - TO−247−2LD CASE 340CL ISSUE A
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FFSH10120A Details

  • Manufacturer Part Number:

    FFSH10120A

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247-2

  • Manufacturer Package Code:

    340CL

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    5.95

  • Additional Feature:

    HIGH RELIABILITY, PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.75 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    90 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    17 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    193 W

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    1200 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

FFSH10120A Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using multiple vias to dissipate heat to the other layers. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including derating the current and voltage according to the temperature derating curve. Additionally, ensure good thermal design, including a heat sink if necessary, and avoid overheating the device.
  • The maximum allowable voltage stress on the FFSH10120A is 1.5 times the maximum rated voltage for a maximum duration of 100ms. Exceeding this limit can cause permanent damage to the device.
  • To protect the device from electrical overstress (EOS), use a transient voltage suppressor (TVS) or a zener diode in parallel with the device. This will help clamp the voltage and prevent damage from voltage spikes or surges.
  • The recommended storage condition for the FFSH10120A is in a dry, cool place with a temperature range of -40°C to 125°C and humidity below 60%. Avoid storing the device in direct sunlight or near heat sources.

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FFSH10120A Overview

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