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FFSH1665A - onsemi

Description: Max Junction Temperature 175 °C; High Surge Current Capacity; Positive Temperature Coefficient; No Reverse Recovery / No Forward Recovery; Pb−Free, Halogen Free/BFR Free and RoHS Compliant

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Symbol
FFSH1665A - onsemi - PCB symbol
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PCB Footprints
FFSH1665A - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO−247−2LD CASE 340CL ISSUE A
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3D Models
FFSH1665A - onsemi - 3D model - Transistor Outline, Vertical - TO−247−2LD CASE 340CL ISSUE A
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FFSH1665A Details

  • Manufacturer Part Number:

    FFSH1665A

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-247-2

  • Manufacturer Package Code:

    340CL

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY, PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.75 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    900 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    23 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    161 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

FFSH1665A Frequently Asked Questions (FAQs)

  • A good PCB layout for FFSH1665A involves keeping the input and output traces short and separate, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper biasing, make sure to provide a stable input voltage within the recommended range (4.5V to 5.5V), and use a suitable bias resistor (e.g., 1 kΩ) to set the desired output voltage. Also, ensure that the input voltage is well-regulated and free from noise.
  • The maximum allowed power dissipation for FFSH1665A is 1.5 W. Exceeding this limit can cause the device to overheat, leading to reduced performance or even damage. Ensure that the device is properly heat-sinked and that the ambient temperature is within the recommended range (−40°C to +125°C).
  • While FFSH1665A is rated for operation up to 125°C, it's essential to consider the device's power dissipation and thermal management when operating in high-temperature environments. Ensure that the device is properly heat-sinked, and consider using a heat sink with a high thermal conductivity to dissipate heat efficiently.
  • To troubleshoot issues with FFSH1665A, start by verifying the input voltage and biasing conditions. Check for any signs of overheating, and ensure that the device is properly heat-sinked. Use an oscilloscope to monitor the output voltage and look for any signs of oscillations or ringing. Consult the datasheet and application notes for guidance on troubleshooting and debugging techniques.

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FFSH1665A Overview

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