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FFSH40120ADN-F085 - onsemi

Description: No Reverse Recovery / No Forward Recovery; Positive Temperature Coefficient; Avalanche Rated 210 mJ; Max Junction Temperature 175 °C; AEC-Q101 qualified and PPAP Capable

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FFSH40120ADN-F085 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - FFSH40120ADN-F085-1
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FFSH40120ADN-F085 - onsemi  - 3D model - Transistor Outline, Vertical - FFSH40120ADN-F085-1
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FFSH40120ADN-F085 Details

  • Manufacturer Part Number:

    FFSH40120ADN-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247-3

  • Manufacturer Package Code:

    340CH

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    5.95

  • Additional Feature:

    AVALANCHE RATED, HIGH RELIABILITY

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.75 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    135 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    220 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    1200 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

FFSH40120ADN-F085 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance, maximum junction temperature, and power handling. Consult with onsemi's application engineers for guidance.
  • Yes, the FFSH40120ADN-F085 is AEC-Q101 qualified, making it suitable for automotive applications. However, additional testing and validation may be required for specific high-reliability applications.
  • Follow proper ESD handling procedures during assembly and storage. The device has built-in ESD protection, but it's still important to handle the device by the body or use an ESD wrist strap to prevent damage.

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FFSH40120ADN-F085 Overview

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