Description:Max Junction Temperature 175 °C; Avalanche Rated 200 mJ; High Surge Current Capacity; Positive Temperature Coefficient; No Reverse Recovery / No Forward Recovery
A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
The maximum allowable voltage transient on the input pins is ±20% of the recommended operating voltage. Exceeding this may cause device damage or malfunction.
Yes, the FFSH40120ADN-F155 is AEC-Q101 qualified and suitable for high-reliability and automotive applications. However, ensure that the device is used within its recommended operating conditions and follow the manufacturer's guidelines for reliability and qualification.
Check the device's operating conditions, power supply, and PCB layout. Verify that the device is used within its recommended operating conditions and that the PCB layout follows the recommended guidelines. Also, check for any signs of physical damage or contamination.
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FFSH40120ADN-F155 Overview
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