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FFSH4065BDN-F085 - onsemi

Description: Max Junction Temperature 175C; Avalanche Rated 94 mJ; High Surge Current Capacity; Positive Temperature Coefficient; Ease of Paralleling; No Reverse Recovery / No Forward Recovery; AEC-Q101 Qualified

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PCB Footprints
FFSH4065BDN-F085 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO−247−3LD CASE 340CX
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3D Models
FFSH4065BDN-F085 - onsemi  - 3D model - Transistor Outline, Vertical - TO−247−3LD CASE 340CX
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FFSH4065BDN-F085 Details

  • Manufacturer Part Number:

    FFSH4065BDN-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247-3LD

  • Manufacturer Package Code:

    340CX

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    HIGH RELIABILITY, PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    84 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    127 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    40 µA

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

FFSH4065BDN-F085 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance can be found in the onsemi application note AND9093/D, which provides guidelines for thermal design and layout considerations.
  • To ensure reliable operation in high-temperature environments, follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using thermal interface materials and heat sinks to reduce junction temperatures.
  • The FFSH4065BDN-F085 has built-in ESD protection, but handling precautions are still necessary. Follow standard ESD handling procedures, such as using wrist straps, anti-static bags, and workbenches, to prevent damage during handling and assembly.
  • Yes, the FFSH4065BDN-F085 is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is manufactured using automotive-grade processes and materials.
  • The recommended soldering and rework conditions for the FFSH4065BDN-F085 can be found in the onsemi application note AND8003/D, which provides guidelines for soldering and rework of onsemi power semiconductor devices.

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FFSH4065BDN-F085 Overview

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