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FFSM2065B - onsemi

Description: Max Junction Temperature 175 °C; Leadless Ultra-thin SMD package; Avalanche Rated 94 mJ; High Surge Current Capacity; Positive Temperature Coefficient; No Reverse Recovery / No Forward Recovery; Low Vf @ TJ:175 °C

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Symbol
FFSM2065B - onsemi - PCB symbol
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PCB Footprints
FFSM2065B - onsemi PCB footprint - Other - Other - PQFN 8X8, 2P CASE 483AP
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3D Models
FFSM2065B - onsemi - 3D model - Other - PQFN 8X8, 2P CASE 483AP
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FFSM2065B Details

  • Manufacturer Part Number:

    FFSM2065B

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PQFN-4

  • Package Description:

    QFN-4

  • Manufacturer Package Code:

    483AP

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    6 Weeks

  • Date Of Intro:

    2020-07-07

  • Manufacturer:

    onsemi

  • YTEOL:

    6.62

  • Additional Feature:

    HIGH RELIABILITY, PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JESD-30 Code:

    S-PSSO-N4

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    77 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    23.4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    160 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    40 µA

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

FFSM2065B Frequently Asked Questions (FAQs)

  • A good PCB layout for FFSM2065B involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper biasing, make sure to follow the recommended biasing circuit in the datasheet, and use a stable voltage source for VCC. Also, ensure that the input voltage is within the recommended range, and that the output is properly terminated.
  • The maximum operating temperature range for FFSM2065B is -40°C to 125°C. However, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • To handle ESD protection for FFSM2065B, use ESD protection devices such as TVS diodes or ESD arrays on the input and output lines. Also, follow proper handling and storage procedures to prevent ESD damage.
  • The recommended storage condition for FFSM2065B is in a dry, cool place with a temperature range of -20°C to 30°C and humidity below 60%. Avoid storing the device in direct sunlight or near heat sources.

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FFSM2065B Overview

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