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FFSP05120A - onsemi

Description: High Surge Current Capacity; Max Junction Temperature 175 °C; Positive Temperature Coefficient; No Reverse Recovery / No Forward Recovery

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FFSP05120A - onsemi - PCB symbol
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PCB Footprints
FFSP05120A - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - to-220 2l to-220,molded ,2ld
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3D Models
FFSP05120A - onsemi - 3D model - Transistor Outline, Vertical - to-220 2l to-220,molded ,2ld
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FFSP05120A Details

  • Manufacturer Part Number:

    FFSP05120A

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220-2

  • Manufacturer Package Code:

    340BB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2017-06-13

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY, PD-CASE

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.75 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    42 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    9.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    94 W

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    1200 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

FFSP05120A Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling capability at high temperatures.
  • The device can withstand a maximum voltage stress of 1.5 times the rated voltage for a short duration (less than 1 second). However, it's recommended to operate the device within the specified voltage range for reliable operation.
  • Yes, the FFSP05120A is suitable for high-frequency switching applications up to 100 kHz. However, ensure that the device is properly snubbed and the PCB layout is optimized for high-frequency operation.
  • Use a transient voltage suppressor (TVS) or a zener diode to clamp the voltage and protect the device from EOS. Also, ensure that the device is operated within the specified voltage and current ratings.

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FFSP05120A Overview

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