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FFSP0665A - onsemi

Description: Max Junction Temperature 175 °C; High Surge Current Capacity; Positive Temperature Coefficient; No Reverse Recovery / No Forward Recovery

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Symbol
FFSP0665A - onsemi - PCB symbol
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PCB Footprints
FFSP0665A - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO−220−2LD CASE 340BB ISSUE O
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3D Models
FFSP0665A - onsemi - 3D model - Transistor Outline, Vertical - TO−220−2LD CASE 340BB ISSUE O
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FFSP0665A Details

  • Manufacturer Part Number:

    FFSP0665A

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220-2

  • Package Description:

    TO-220, 2 PIN

  • Manufacturer Package Code:

    340BB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    5.42

  • Additional Feature:

    HIGH RELIABILITY, PD-CASE

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.75 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    42 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    8.8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    65 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

FFSP0665A Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The device should be placed near a thermal pad or a heat sink to ensure good thermal conduction.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal pad to maintain a low junction temperature. Monitor the device's thermal resistance (RθJA) and ensure it is within the specified range.
  • A gate drive voltage of 10-15V is recommended for optimal switching performance. This ensures that the device is fully enhanced and minimizes switching losses.
  • Use a dead-time controller or a gate driver with a built-in dead-time generator to prevent shoot-through current. Ensure that the dead-time is set to at least 100ns to allow for proper switching transitions.
  • Use a compact layout with short traces and minimize loop areas to reduce EMI. Use a ground plane and decoupling capacitors to reduce noise and ringing. Ensure that the device is placed away from noise-sensitive components.

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FFSP0665A Overview

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