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FHC32322ADTP - Kamaya

Description: Chip Fuses 1206 inch 32Vdc 3.15A

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FHC32322ADTP - Kamaya  - 3D model
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FHC32322ADTP Details

  • Manufacturer Part Number:

    FHC32322ADTP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.10.00.40

  • Manufacturer:

    Kamaya Inc

  • YTEOL:

    7.5

  • Body Breadth:

    1.6 mm

  • Body Height:

    0.65 mm

  • Body Length or Diameter:

    3.2 mm

  • Circuit Protection Type:

    ELECTRIC FUSE

  • Fuse Size:

    1206

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Packing Method:

    TR, PAPER, 7 INCH

  • Pre-arcing Time-Min:

    5000 ms

  • Rated Breaking Capacity:

    50 A

  • Rated Current:

    3.15 A

  • Rated Voltage(DC):

    32 V

  • Reference Standard:

    CSA; UL

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Shape:

    WRAPAROUND

FHC32322ADTP Frequently Asked Questions (FAQs)

  • Kamaya Inc recommends a 2-layer PCB with a thermal via array under the package to dissipate heat efficiently. A minimum of 10 thermal vias with a diameter of 0.3mm is recommended.
  • To ensure reliable operation in high-vibration environments, Kamaya Inc recommends securing the device with a suitable mounting mechanism, such as a screw or adhesive, and using a vibration-dampening material, such as a silicone gel, between the device and the PCB.
  • The maximum allowable power derating for FHC32322ADTP is 20% above the recommended operating conditions. Exceeding this limit may result in reduced reliability or premature failure.
  • Yes, FHC32322ADTP is designed to operate in humid environments, but it's essential to follow proper moisture-sensitive device handling and storage procedures to prevent damage. A humidity level of up to 90% RH is acceptable, but it's recommended to use a conformal coating or potting compound to protect the device in extremely humid environments.
  • Kamaya Inc recommends a soldering profile with a peak temperature of 260°C, a dwell time of 30 seconds, and a ramp rate of 3°C/s. It's essential to follow the recommended soldering profile to prevent damage to the device.

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FHC32322ADTP Overview

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