A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
Use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher. For input capacitors, use 10uF to 22uF, and for output capacitors, use 22uF to 47uF.
Use a shielded enclosure, keep the layout compact, and minimize loop areas. Add EMI filters or common-mode chokes as needed. Ensure proper grounding and decoupling of the device.
Apply the input voltage (VIN) first, followed by the enable signal (EN). Ensure the input voltage is stable before applying the enable signal.
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FL6961MY Overview
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