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FLLD261 - onsemi

Description: Last Shipments - MOSFET Integrated Smart LED Lamp Driver IC with PFC Function

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PCB Footprints
FLLD261 - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR
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3D Models
FLLD261 - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR
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FLLD261 Details

  • Manufacturer Part Number:

    FLLD261

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23 (TO-236) 2.90x1.30x1.00, 1.90P

  • Manufacturer Package Code:

    318

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    200 V

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.4 V

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    3 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.35 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    0.005 µA

  • Reverse Recovery Time-Max:

    0.4 µs

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

FLLD261 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested. Refer to onsemi's application note AND8325/D for more details.
  • The FLLD261 requires a bias voltage of 5V to 15V. Ensure the input voltage is within this range and the output is properly terminated to maintain stability. A 10uF capacitor is recommended between the bias pin and ground for noise filtering.
  • The FLLD261 is designed to operate up to 100 MHz. However, the actual operating frequency may vary depending on the specific application and layout. It's recommended to consult onsemi's application notes and simulation tools for optimal design.
  • The FLLD261 has built-in ESD protection, but additional protection measures are recommended. Use ESD-sensitive handling procedures, and consider adding external ESD protection devices, such as TVS diodes, to ensure device reliability.
  • The recommended storage temperature range for the FLLD261 is -40°C to 125°C. Storage outside this range may affect device reliability and performance.

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FLLD261 Overview

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