Bivar recommends a PCB layout with a solid ground plane and thermal vias under the device to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
Bivar recommends using a soldering temperature of 250°C (max) and a soldering time of 3 seconds (max) to prevent damage to the device. A soldering iron with a fine tip is recommended.
The maximum allowable voltage drop across the FLPV2.1-SG is 1.5V. Exceeding this voltage drop may affect the device's performance and reliability.
The FLPV2.1-SG is rated for operation up to 85°C. However, derating is required for temperatures above 70°C. Consult the datasheet for derating curves and guidelines.
Bivar recommends using ESD-safe handling procedures, including the use of ESD wrist straps, mats, and packaging materials. The FLPV2.1-SG has an ESD rating of 2kV human body model (HBM).
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FLPV2.1-SG Overview
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