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FM1808B-SG - Infineon

Description: F-RAM 256Kb 70ns 32K x 8 Parallel FRAM

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PCB Footprints
FM1808B-SG - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 28 pin SOIC S21
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3D Models
FM1808B-SG - Infineon  - 3D model - Small Outline Packages - 28 pin SOIC S21
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FM1808B-SG Details

  • Manufacturer Part Number:

    FM1808B-SG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    4.9

  • Access Time-Max:

    70 ns

  • Additional Feature:

    DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

  • Data Retention Time-Min:

    10

  • Endurance:

    100000000000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    17.905 mm

  • Memory Density:

    262144 bit

  • Memory IC Type:

    FRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Words:

    32768 words

  • Number of Words Code:

    32000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.67 mm

  • Standby Current-Max:

    0.00005 A

  • Standby Voltage-Min:

    4.5 V

  • Supply Current-Max:

    0.015 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Pure Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    7.505 mm

FM1808B-SG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure good heat dissipation.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer.
  • The maximum allowed voltage on the VCC pin is 5.5V. Exceeding this voltage may damage the device.
  • Use ESD-protective packaging, handle the device by the body or pins, and avoid touching the pins. Use an ESD wrist strap or mat during assembly.
  • Follow the JEDEC J-STD-020D.1 standard for lead-free soldering. The recommended peak temperature is 260°C, with a maximum time above 217°C of 45 seconds.

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FM1808B-SG Overview

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Part Image FM1808B-SG Ramtron International Corporation

FRAM, 32KX8, Parallel, PDSO28