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FM1808B-SGTR - Infineon

Description: F-RAM 256Kb 70ns 32K x 8 Parallel FRAM

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PCB Footprints
FM1808B-SGTR - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 28 pin SOIC S21
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3D Models
FM1808B-SGTR - Infineon  - 3D model - Small Outline Packages - 28 pin SOIC S21
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FM1808B-SGTR Details

  • Manufacturer Part Number:

    FM1808B-SGTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    4.9

  • Access Time-Max:

    70 ns

  • Additional Feature:

    DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

  • Data Retention Time-Min:

    10

  • Endurance:

    100000000000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    17.905 mm

  • Memory Density:

    262144 bit

  • Memory IC Type:

    FRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Words:

    32768 words

  • Number of Words Code:

    32000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.67 mm

  • Standby Current-Max:

    0.00005 A

  • Standby Voltage-Min:

    4.5 V

  • Supply Current-Max:

    0.015 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Pure Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.505 mm

FM1808B-SGTR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure efficient heat dissipation.
  • Use a thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Also, consider using a heat sink with a high thermal conductivity and a low thermal resistance.
  • The critical timing parameters include the input rise and fall times, the output delay, and the clock-to-output delay. These parameters are critical for ensuring reliable operation and should be carefully considered during design.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Also, ensure that the PCB layout is designed to minimize ESD susceptibility.
  • Use a combination of ceramic and electrolytic capacitors with values ranging from 10nF to 10uF. Place the capacitors close to the device and ensure that the PCB layout is designed to minimize inductance and resistance.

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