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FM18W08-SG - Infineon

Description: 256-Kbit (32 K × 8) Wide Voltage Bytewide F-RAM Memory

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FM18W08-SG - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - soic-28
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FM18W08-SG - Infineon  - 3D model - Small Outline Packages - soic-28
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FM18W08-SG Details

  • Manufacturer Part Number:

    FM18W08-SG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    4.9

  • Access Time-Max:

    80 ns

  • Additional Feature:

    DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

  • Data Retention Time-Min:

    10

  • Endurance:

    100000000000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    17.905 mm

  • Memory Density:

    262144 bit

  • Memory IC Type:

    FRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Words:

    32768 words

  • Number of Words Code:

    32000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.67 mm

  • Standby Current-Max:

    0.00005 A

  • Standby Voltage-Min:

    2.7 V

  • Supply Current-Max:

    0.012 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Pure Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.505 mm

FM18W08-SG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The FM18W08-SG should be placed near the center of the board, and the decoupling capacitors should be placed as close as possible to the device.
  • Use a reliable communication protocol such as SPI or I2C, and ensure that the clock frequency is within the specified range. Also, use a pull-up resistor on the SCL line and a pull-down resistor on the SDA line.
  • The FM18W08-SG can operate in the temperature range of -40°C to 125°C. However, the device's performance may degrade at extreme temperatures, so it's recommended to operate within the specified temperature range for optimal performance.
  • The FM18W08-SG has a built-in power-on reset circuit, but it's recommended to use an external power-on reset circuit to ensure reliable startup. For power-down sequencing, ensure that the power supply to the FM18W08-SG is turned off last and turned on first to prevent damage to the device.
  • The FM18W08-SG has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-free environment.

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