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FM18W08-SGTR - Infineon

Description: CYPRESS SEMICONDUCTOR - FM18W08-SGTR - F-RAM, NON-VOL, 256KBIT, SOIC-28

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PCB Footprints
FM18W08-SGTR - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 28-Pin SOIC-ren1
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3D Models
FM18W08-SGTR - Infineon  - 3D model - Small Outline Packages - 28-Pin SOIC-ren1
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FM18W08-SGTR Details

  • Manufacturer Part Number:

    FM18W08-SGTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    4.9

  • Access Time-Max:

    80 ns

  • Additional Feature:

    DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

  • Data Retention Time-Min:

    10

  • Endurance:

    100000000000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    17.905 mm

  • Memory Density:

    262144 bit

  • Memory IC Type:

    FRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Words:

    32768 words

  • Number of Words Code:

    32000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.67 mm

  • Standby Current-Max:

    0.00005 A

  • Standby Voltage-Min:

    2.7 V

  • Supply Current-Max:

    0.012 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Pure Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.505 mm

FM18W08-SGTR Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve heat dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm is recommended.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement proper thermal management, such as heat sinks or thermal interfaces, to maintain a safe operating temperature.
  • Infineon recommends a peak reflow temperature of 260°C, with a soldering time of 30-60 seconds. The device is compatible with lead-free soldering processes.
  • Handle the device with ESD-protective equipment and follow standard ESD precautions, such as using wrist straps, ESD mats, and ionizers. Ensure that the device is stored in its original packaging or an ESD-protective bag when not in use.
  • Infineon recommends using X7R or X5R ceramic capacitors with a capacitance value of 10-22 μF for input and output filtering. The capacitor voltage rating should be at least 2x the maximum input voltage.

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