FM22L16-55-TG - Infineon

FM22L16-55-TG Details

• Manufacturer Part Number:

  FM22L16-55-TG

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Country Of Origin:

  Mainland China, Taiwan

• Factory Lead Time:

  8 Weeks

• Manufacturer:

  Infineon Technologies AG

• YTEOL:

  4.9

• Access Time-Max:

  110 ns

• Additional Feature:

  DATA RETENTION TIME @ 85 DEGREE CENTIGRADE;2.5KV ESD AVAILABLE;ALSO CONFIGURABLE AS 512KX8

• Data Retention Time-Min:

  10

• Endurance:

  100000000000000 Write/Erase Cycles

• JESD-30 Code:

  R-PDSO-G44

• JESD-609 Code:

  e3

• Length:

  18.41 mm

• Memory Density:

  4194304 bit

• Memory IC Type:

  FRAM

• Memory Width:

  16

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  44

• Number of Words:

  262144 words

• Number of Words Code:

  256000

• Operating Mode:

  ASYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  256KX16

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TSOP2

• Package Equivalence Code:

  TSOP44,.46,32

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, THIN PROFILE

• Parallel/Serial:

  PARALLEL

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  1.2 mm

• Standby Current-Max:

  0.00027 A

• Standby Voltage-Min:

  2.7 V

• Supply Current-Max:

  0.012 mA

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  2.7 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Pure Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  10.16 mm