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FM24CL04B-GTR - Infineon

Description: CYPRESS SEMICONDUCTOR - FM24CL04B-GTR - F-RAM, NV, 4KBIT, 1MHZ, SOIC-8

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FM24CL04B-GTR - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8-PIN SOIC (150 mils) 51-85066
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3D Models
FM24CL04B-GTR - Infineon  - 3D model - Small Outline Packages - 8-PIN SOIC (150 mils) 51-85066
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FM24CL04B-GTR Details

  • Manufacturer Part Number:

    FM24CL04B-GTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Country Of Origin:

    Taiwan, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Additional Feature:

    ALSO OPERATES WITH 0.4 MHZ AND 0.1 MHZ :2KV ESD AVAILABLE

  • Clock Frequency-Max (fCLK):

    1 MHz

  • Data Retention Time-Min:

    10

  • Endurance:

    100000000000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.889 mm

  • Memory Density:

    4096 bit

  • Memory IC Type:

    FRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    512 words

  • Number of Words Code:

    512

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512X8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.727 mm

  • Serial Bus Type:

    I2C

  • Standby Current-Max:

    0.000006 A

  • Standby Voltage-Min:

    2.7 V

  • Supply Current-Max:

    0.0003 mA

  • Supply Voltage-Max (Vsup):

    3.65 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Pure Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.8985 mm

  • Write Protection:

    HARDWARE

FM24CL04B-GTR Frequently Asked Questions (FAQs)

  • A good PCB layout for the FM24CL04B-GTR involves keeping the device away from high-frequency noise sources, using a solid ground plane, and minimizing the length of the clock signal traces. Additionally, it's recommended to use a 0.1uF decoupling capacitor between VCC and GND, and to keep the EEPROM's power supply lines (VCC and GND) as short as possible.
  • To ensure data integrity, it's essential to follow the recommended power-up and power-down sequences outlined in the datasheet. Additionally, consider implementing a power-fail detect circuit to detect power-down events and prevent data corruption. It's also recommended to use a capacitor on the VCC line to filter out noise and ensure a clean power supply.
  • When writing data to the FM24CL04B-GTR, use the recommended write cycle timing and ensure that the device is not accessed during the write cycle. When reading data, use a pull-up resistor on the SCL line to prevent bus contention, and ensure that the device is properly initialized before accessing the EEPROM. It's also recommended to use a clock frequency within the specified range (100 kHz to 400 kHz) to ensure reliable data transfer.
  • Implement error detection and correction mechanisms, such as checksums or CRCs, to detect data corruption or transmission errors. Additionally, consider implementing a retry mechanism to handle temporary errors or bus contention. It's also essential to follow the recommended protocol for handling ACK and NACK responses from the device.
  • The FM24CL04B-GTR is rated for operation from -40°C to 85°C. To ensure reliable operation, ensure that the device is operated within the specified temperature range, and consider using thermal management techniques such as heat sinks or thermal interfaces to dissipate heat. Additionally, follow the recommended PCB layout and thermal design guidelines to minimize thermal gradients and hotspots.

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