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FPF1203UCX - onsemi

Description: Power Switch ICs - Power Distribution Ultra Smll Slew Rate Controlled Load Swth

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PCB Footprints
FPF1203UCX - onsemi PCB footprint - BGA - BGA - WLCSP4 0.76x0.76x0.586
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3D Models
FPF1203UCX - onsemi  - 3D model - BGA - WLCSP4 0.76x0.76x0.586
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FPF1203UCX Details

  • Manufacturer Part Number:

    FPF1203UCX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    WLCSP-4

  • Manufacturer Package Code:

    567SS

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    S-PBGA-B4

  • JESD-609 Code:

    e1

  • Length:

    0.76 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO/NC

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA4,2X2,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.539 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.2 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.76 mm

FPF1203UCX Frequently Asked Questions (FAQs)

  • A recommended PCB layout for the FPF1203UCX includes a thermal pad connected to a large copper area on the PCB, with multiple vias to dissipate heat. The datasheet provides a recommended land pattern and thermal pad layout.
  • The input capacitor should be selected based on the input voltage, output voltage, and output current requirements. A general guideline is to choose a capacitor with a capacitance value of at least 10uF and a voltage rating of at least 1.5 times the input voltage.
  • The maximum output current capability of the FPF1203UCX is 3A, but it can be limited by the thermal performance of the device and the PCB. The datasheet provides a thermal derating curve to determine the maximum output current based on the ambient temperature.
  • To ensure stability, the FPF1203UCX requires a minimum output capacitance of 10uF and a maximum equivalent series resistance (ESR) of 1 ohm. Additionally, the input capacitor should be placed close to the device and the output capacitor should be placed close to the load.
  • The EN (enable) pin is used to turn the device on and off. When the EN pin is pulled low, the device is in shutdown mode and consumes minimal current. When the EN pin is pulled high, the device is enabled and operates normally.

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