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FS1DE-TP - MCC

Description: DIODE GEN PURP 200V 1A SMAE

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FS1DE-TP - MCC - PCB symbol
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PCB Footprints
FS1DE-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMAE
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FS1DE-TP - MCC - 3D model - Diodes Moulded - SMAE
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FS1DE-TP Details

  • Manufacturer Part Number:

    FS1DE-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SMAE, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    0

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.15 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

FS1DE-TP Frequently Asked Questions (FAQs)

  • The recommended PCB layout and land pattern for the FS1DE-TP can be found in the Micro Commercial Components' application note AN-113, which provides detailed guidelines for optimal performance and thermal management.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal management guidelines, including proper heat sinking, thermal interface materials, and airflow. Additionally, consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
  • The FS1DE-TP has built-in ESD protection, but it's still essential to follow standard ESD handling precautions, such as using an ESD wrist strap, mat, or workstation, and storing the devices in anti-static packaging. Avoid touching the device's pins or exposing it to electrostatic charges during handling and assembly.
  • Yes, the FS1DE-TP can be used in switching regulator applications. However, it's crucial to consider the device's switching frequency, voltage ratings, and power handling capabilities. Ensure that the device is operated within its recommended specifications, and consider the impact of switching losses, voltage spikes, and thermal management on the overall system performance.
  • The reliability and MTBF (Mean Time Between Failures) expectations for the FS1DE-TP can be found in the device's reliability report, which is typically available upon request from Micro Commercial Components. The report provides detailed information on the device's failure rates, FIT (Failures In Time) rates, and MTBF calculations based on various operating conditions and stress factors.

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FS1DE-TP Overview

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