FS32K146HFT0MMHR - NXP

FS32K146HFT0MMHR Details

• Manufacturer Part Number:

  FS32K146HFT0MMHR

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  MABGA-100

• ECCN Code:

  5A992.C

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  12 Weeks

• Date Of Intro:

  2020-03-05

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  8.08

• Has ADC:

  YES

• Bit Size:

  32

• Boundary Scan:

  YES

• CPU Family:

  CORTEX-M4F

• Clock Frequency-Max:

  40 MHz

• DAC Channels:

  NO

• DMA Channels:

  YES

• Format:

  FLOATING-POINT

• Integrated Cache:

  YES

• JESD-30 Code:

  S-PBGA-B100

• JESD-609 Code:

  e2

• Length:

  11 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of DMA Channels:

  16

• Number of I/O Lines:

  89

• Number of Serial I/Os:

  3

• Number of Terminals:

  100

• Number of Timers:

  50

• On Chip Data RAM Width:

  8

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LBGA

• Package Equivalence Code:

  BGA100,10X10,39

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE

• Peak Reflow Temperature (Cel):

  260

• RAM (bytes):

  131072

• ROM (words):

  1048576

• ROM Programmability:

  FLASH

• Screening Level:

  ISO 26262

• Seated Height-Max:

  1.41 mm

• Speed:

  80 MHz

• Supply Voltage-Max:

  5.5 V

• Supply Voltage-Min:

  2.7 V

• Supply Voltage-Nom:

  5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Silver (Sn/Ag)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  11 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC