FS32V234BLN1VUB - NXP

FS32V234BLN1VUB Details

• Manufacturer Part Number:

  FS32V234BLN1VUB

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  FCBGA-621

• Country Of Origin:

  Malaysia

• ECCN Code:

  5A992.C

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  4 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Bit Size:

  64

• Boundary Scan:

  YES

• Clock Frequency-Max:

  40 MHz

• Format:

  FLOATING POINT

• Integrated Cache:

  YES

• JESD-30 Code:

  S-PBGA-B621

• JESD-609 Code:

  e2

• Length:

  17 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of DMA Channels:

  32

• Number of External Interrupts:

  1

• Number of Terminals:

  621

• On Chip Data RAM Width:

  8

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  FBGA

• Package Equivalence Code:

  BGA621,25X25,25

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• RAM (words):

  4194304

• Screening Level:

  AEC-Q100

• Seated Height-Max:

  2.44 mm

• Speed:

  800 MHz

• Supply Voltage-Max:

  1.05 V

• Supply Voltage-Min:

  0.95 V

• Supply Voltage-Nom:

  1 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver (Sn/Ag)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  17 mm

• uPs/uCs/Peripheral ICs Type:

  MICROPROCESSOR, RISC