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FS6370-01G-XTD - onsemi

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FS6370-01G-XTD - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 16-pin SOIC (0.150")
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FS6370-01G-XTD - onsemi  - 3D model - Small Outline Packages - 16-pin SOIC (0.150")
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FS6370-01G-XTD Details

  • Manufacturer Part Number:

    FS6370-01G-XTD

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    0.150 INCH, GREEN, SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    751BA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES WITH 3.3V SUPPLY

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.89 mm

  • Moisture Sensitivity Level:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Output Clock Frequency-Max:

    150 MHz

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Primary Clock/Crystal Frequency-Nom:

    27 MHz

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.73 mm

  • Supply Current-Max:

    43 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • uPs/uCs/Peripheral ICs Type:

    CLOCK GENERATOR, PROCESSOR SPECIFIC

FS6370-01G-XTD Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K, and follow the recommended PCB layout guidelines. Also, consider using a heat sink with a thermal resistance of less than 10°C/W.
  • The maximum allowed voltage on the VIN pin is 28V, but it's recommended to keep it below 24V for optimal reliability and to prevent damage to the internal voltage regulator.
  • Check the input voltage, ensure proper PCB layout, and verify that the enable pin is properly biased. Also, check for any short circuits or excessive current draw on the output.
  • Yes, the FS6370-01G-XTD is qualified for automotive and high-reliability applications. However, it's essential to follow the recommended design guidelines and testing procedures to ensure compliance with the required standards.

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FS6370-01G-XTD Overview

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