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FS6377-01G-XTD - onsemi

Description: Programmable 3-PLL Clock Generator IC

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PCB Footprints
FS6377-01G-XTD - onsemi PCB footprint - Other - Other - SOIC127P600X173-16N
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FS6377-01G-XTD Details

  • Manufacturer Part Number:

    FS6377-01G-XTD

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    751FB

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES WITH 3.3V SUPPLY

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.89 mm

  • Moisture Sensitivity Level:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Output Clock Frequency-Max:

    150 MHz

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Primary Clock/Crystal Frequency-Nom:

    27 MHz

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.73 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • uPs/uCs/Peripheral ICs Type:

    CLOCK GENERATOR, PROCESSOR SPECIFIC

FS6377-01G-XTD Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended PCB layout guidelines. Also, consider derating the device's current handling capability at high temperatures.
  • The maximum allowable voltage stress on the device's pins is ±20V, with a maximum voltage rating of 40V. Exceeding this rating may cause permanent damage to the device.
  • Handle the device with an ESD wrist strap or mat, and ensure that the PCB is designed with ESD protection in mind, such as using ESD diodes or resistors on the input pins.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, not the leads, and avoid bending or flexing the leads.

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FS6377-01G-XTD Overview

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