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FSA221L10X - onsemi

Description: Multimedia and USB 2.0 Hi-Speed and Audio Switches w/ Negative Signal Capability 3.3V, 5V , 720 MHz , 4.5pF , -65C ~ +150C

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Symbol
FSA221L10X - onsemi - PCB symbol
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PCB Footprints
FSA221L10X - onsemi PCB footprint - Other - Other - 10-Lead MicroPak_2026
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3D Models
FSA221L10X - onsemi - 3D model - Other - 10-Lead MicroPak_2026
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FSA221L10X Details

  • Manufacturer Part Number:

    FSA221L10X

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    MICROPAK-10

  • Manufacturer Package Code:

    523AZ

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    DPDT

  • JESD-30 Code:

    R-XQCC-N10

  • JESD-609 Code:

    e4

  • Length:

    2.1 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO/NC

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    37 dB

  • On-state Resistance Match-Nom:

    0.4 Ω

  • On-state Resistance-Max (Ron):

    5 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC10,.06X.08,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.55 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    10000 ns

  • Switch-on Time-Max:

    10000 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

FSA221L10X Frequently Asked Questions (FAQs)

  • A good PCB layout for the FSA221L10X should minimize parasitic inductance and capacitance. Place the device close to the power source, use short and wide traces for power and ground, and avoid vias under the device. A 4-layer PCB with a solid ground plane is recommended.
  • Proper thermal management is crucial for the FSA221L10X. Ensure good airflow around the device, use a heat sink if possible, and avoid blocking the thermal pad. The thermal pad should be connected to a solid ground plane or a thermal relief pattern.
  • The maximum allowed voltage on the EN pin of the FSA221L10X is 6V. Exceeding this voltage may damage the device. It's recommended to use a voltage limiter or a resistor divider to ensure the EN pin voltage remains within the specified range.
  • The FSA221L10X is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the device's current handling capability and ensure proper thermal management when operating in high-temperature environments.
  • To troubleshoot issues with the FSA221L10X, check the input voltage, output current, and thermal management. Verify that the device is properly soldered and that there are no shorts or opens on the PCB. Use a thermal camera or thermometer to check the device temperature. Consult the datasheet and application notes for guidance on troubleshooting specific issues.

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FSA221L10X Overview

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Part Image FSA221L10X Fairchild Semiconductor Corporation

DPDT, 1 Func, 2 Channel, QCC10