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FSA2267L10X - onsemi

Description: IC SWITCH DUAL SPDT 10MICROPAK

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PCB Footprints
FSA2267L10X - onsemi PCB footprint - Other - Other - UQFN10 1.6X2.1, 0.5P CASE 523AZ ISSUE O
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3D Models
FSA2267L10X - onsemi  - 3D model - Other - UQFN10 1.6X2.1, 0.5P CASE 523AZ ISSUE O
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FSA2267L10X Details

  • Manufacturer Part Number:

    FSA2267L10X

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    MICROPAK-10

  • Manufacturer Package Code:

    523AZ

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-XQCC-N10

  • JESD-609 Code:

    e4

  • Length:

    2.1 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO/NC

  • Number of Channels:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    80 dB

  • On-state Resistance Match-Nom:

    0.04 Ω

  • On-state Resistance-Max (Ron):

    0.75 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC10,.06X.08,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.55 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    2.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    18 ns

  • Switch-on Time-Max:

    37 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

FSA2267L10X Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize noise coupling.
  • Follow the recommended power-up and power-down sequencing in the datasheet. Ensure that the input voltage (VIN) is stable and within the recommended range before enabling the device.
  • The maximum allowable capacitance for COUT is 10uF. Exceeding this value may cause instability or oscillations in the output voltage.
  • The FSA2267L10X is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Ensure proper thermal management and consider derating the device's specifications accordingly.
  • Check the input voltage, output load, and PCB layout for any anomalies. Verify that the device is properly powered up and powered down. Use an oscilloscope to monitor the output voltage and input current. Consult the datasheet and application notes for troubleshooting guidelines.

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