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FSA2269TSUMX - onsemi

Description: Analog Switch ICs LV Dual-SPDT 0.4Ohm Analog Switch

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Symbol
FSA2269TSUMX - onsemi - PCB symbol
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PCB Footprints
FSA2269TSUMX - onsemi PCB footprint - Other - Other - FSA2269TSUMX-2
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FSA2269TSUMX - onsemi - 3D model - Other - FSA2269TSUMX-2
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FSA2269TSUMX Details

  • Manufacturer Part Number:

    FSA2269TSUMX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    UMLP-10

  • Manufacturer Package Code:

    523BC

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-XQCC-N10

  • JESD-609 Code:

    e4

  • Length:

    1.8 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NC

  • Number of Channels:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    70 dB

  • On-state Resistance Match-Nom:

    0.4 Ω

  • On-state Resistance-Max (Ron):

    0.8 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC10,.06X.07,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.55 mm

  • Signal Current-Max:

    0.35 A

  • Supply Voltage-Max (Vsup):

    4.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    2.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    55 ns

  • Switch-on Time-Max:

    100 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.4 mm

FSA2269TSUMX Frequently Asked Questions (FAQs)

  • A good PCB layout for the FSA2269TSUMX involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces connecting the device to the capacitors and resistors. A 4-layer PCB with a dedicated ground plane is recommended.
  • The FSA2269TSUMX requires a single 1.8V power supply. It's recommended to power the device using a low-dropout linear regulator or a switching regulator with a low noise output. The power sequencing requirement is to power up the VDD pin before the VDDIO pin.
  • A 1uF to 10uF ceramic capacitor with an X5R or X7R dielectric is recommended for the VDD pin, and a 1uF to 4.7uF ceramic capacitor with an X5R or X7R dielectric is recommended for the VDDIO pin. The capacitor should be placed as close to the pin as possible.
  • The FSA2269TSUMX is a highly configurable device. For specific applications, refer to the onsemi application notes and design guides, which provide detailed configuration and layout recommendations for USB-C, DisplayPort, and other applications.
  • The FSA2269TSUMX has a thermal pad on the bottom of the package, which should be connected to a solid ground plane on the PCB to dissipate heat. A thermal via array can also be used to improve heat dissipation. The device can operate up to 85°C ambient temperature.

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FSA2269TSUMX Overview

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