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FSA2467MPX - onsemi

Description: ANALOG SWITCH, DUAL, DPDT, MLP-16

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FSA2467MPX - onsemi  - 3D model
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FSA2467MPX Details

  • Manufacturer Part Number:

    FSA2467MPX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    MLP-16

  • Manufacturer Package Code:

    510BS

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    DPDT

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO/NC

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    75 dB

  • On-state Resistance Match-Nom:

    0.03 Ω

  • On-state Resistance-Max (Ron):

    0.55 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    4.3 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    2.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    52 ns

  • Switch-on Time-Max:

    80 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

FSA2467MPX Frequently Asked Questions (FAQs)

  • A good PCB layout for the FSA2467MPX involves keeping the input and output traces as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The FSA2467MPX requires a single 1.8V power supply. It's recommended to use a low-dropout linear regulator (LDO) to power the device. Power sequencing is not critical, but it's recommended to power up the device after the power supply has stabilized.
  • The FSA2467MPX supports data transfer rates up to 480 Mbps, making it suitable for high-speed applications such as USB 2.0 and other high-speed interfaces.
  • The FSA2467MPX has built-in ESD protection, but it's still recommended to implement external ESD protection measures such as TVS diodes or ESD protection arrays to ensure the device is protected from external ESD events.
  • The FSA2467MPX has a maximum junction temperature of 150°C. To ensure reliable operation, it's recommended to keep the device temperature below 125°C. This can be achieved by using a heat sink, improving airflow, and reducing power consumption.

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FSA2467MPX Overview

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Part Image FSA2467MPX Fairchild Semiconductor Corporation

DPDT, 2 Func, 2 Channel, CMOS, QCC16