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FSA3051TMX - onsemi

Description: Low Power Consumption: 1 μA Maximum; Wide -3 db Bandwidth: 1.0 GHz; Broad VCC Operating Range: 1.6 V to 5.5 V; Over-Voltage Tolerance (OVT) on all Data Ports up to 6 V without External Components; Low On Resistance: 6 Ω Typical; Packaged in Ultra Small 6-Lead TMLP ; Low On Capacitance: 7.7 pF Typical; 15 μA Maximum ICCT over an Expanded Voltage Range (VIN=1.8 V, VCC=5.5 V)

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PCB Footprints
FSA3051TMX - onsemi PCB footprint - Other - Other - 6-Lead TMLP
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3D Models
FSA3051TMX - onsemi  - 3D model - Other - 6-Lead TMLP
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FSA3051TMX Details

  • Manufacturer Part Number:

    FSA3051TMX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    X2DFN-6

  • Package Description:

    TMLP-6

  • Manufacturer Package Code:

    716AA

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Date Of Intro:

    2017-10-09

  • Manufacturer:

    onsemi

  • YTEOL:

    3

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    1 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO/NC

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Off-state Isolation-Nom:

    20 dB

  • On-state Resistance Match-Nom:

    40 Ω

  • On-state Resistance-Max (Ron):

    25 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC6,.04,14

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.4 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.6 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1 mm

FSA3051TMX Frequently Asked Questions (FAQs)

  • A good PCB layout for the FSA3051TMX involves keeping the input and output traces short and wide, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable 3.3V or 5V power supply, and the GND pin to a solid ground plane. The EN pin should be tied to VCC or a digital signal for enable/disable functionality. The VIN pin should be connected to a stable input voltage.
  • The maximum current rating of the FSA3051TMX is 1A. However, it's recommended to limit the current to 0.5A for optimal performance and to prevent overheating.
  • To protect the FSA3051TMX from ESD and overvoltage, use TVS diodes or ESD protection devices on the input and output lines. Additionally, add a fuse or a PTC resettable fuse to prevent overcurrent conditions.
  • The recommended operating temperature range for the FSA3051TMX is -40°C to 85°C. However, the device can operate up to 125°C with reduced performance and reliability.

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