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FSA550UCX - onsemi

Description: THD+N: 0.002% Typical; Audio Frequency Range; RON: 0.8 Ω Typical; Depletion Mode MOSFETs; VCC(OFF): 1.6 V to 3.0 V; 4PST (NC); Eco Status: Fairchild Green, RoHS Compliant, Halogen Free; RON Flat: 0.01 Ω Typical

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PCB Footprints
FSA550UCX - onsemi PCB footprint - BGA - BGA - FSA550UCX
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FSA550UCX - onsemi  - 3D model - BGA - FSA550UCX
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FSA550UCX Details

  • Manufacturer Part Number:

    FSA550UCX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    WLCSP-12

  • Package Description:

    WLCSP-12

  • Manufacturer Package Code:

    567QG

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    36 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    4PST

  • JESD-30 Code:

    R-PBGA-B12

  • JESD-609 Code:

    e1

  • Length:

    1.56 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NC

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Off-state Isolation-Nom:

    90 dB

  • On-state Resistance-Max (Ron):

    0.8 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA12,3X4,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.625 mm

  • Supply Voltage-Max (Vsup):

    3 V

  • Supply Voltage-Min (Vsup):

    1.6 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    120 ns

  • Switch-on Time-Max:

    120 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.16 mm

FSA550UCX Frequently Asked Questions (FAQs)

  • A good PCB layout for the FSA550UCX involves placing the device close to the load, using short and wide traces for the output, and separating the input and output sections to minimize noise coupling. A 4-layer PCB with a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, add a 10nF to 22nF capacitor in parallel with the output capacitor to improve stability. Also, ensure the input voltage is within the recommended range and the output is not overloaded.
  • The maximum output current of the FSA550UCX is 5A, but it's recommended to derate the output current based on the ambient temperature and the desired reliability. A good rule of thumb is to limit the output current to 3A to ensure reliable operation.
  • The FSA550UCX is rated for operation up to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. Ensure proper heat sinking and thermal management to prevent overheating, especially in high-temperature environments.
  • Use a TVS (Transient Voltage Suppressor) diode or a voltage clamp circuit at the input to protect the FSA550UCX from voltage transients. This will help prevent damage from voltage spikes or surges.

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