FSA551UCX - onsemi

FSA551UCX Details

• Manufacturer Part Number:

  FSA551UCX

• Brand Name:

  onsemi

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  WLCSP-9

• Package Description:

  WLCSP-9

• Manufacturer Package Code:

  567SV

• HTS Code:

  8542.39.00.60

• Manufacturer:

  onsemi

• YTEOL:

  0

• Analog IC - Other Type:

  SPST

• JESD-30 Code:

  R-PBGA-B9

• JESD-609 Code:

  e1

• Length:

  1.38 mm

• Moisture Sensitivity Level:

  1

• Normal Position:

  NC

• Number of Channels:

  2

• Number of Functions:

  1

• Number of Terminals:

  9

• Off-state Isolation-Nom:

  75 dB

• On-state Resistance Match-Nom:

  0.01 Ω

• On-state Resistance-Max (Ron):

  0.6 Ω

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Output:

  SEPARATE OUTPUT

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VFBGA

• Package Equivalence Code:

  BGA9,3X3,16

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  0.619 mm

• Supply Current-Max (Isup):

  0.12 mA

• Supply Voltage-Max (Vsup):

  3 V

• Supply Voltage-Min (Vsup):

  1.5 V

• Surface Mount:

  YES

• Switching:

  BREAK-BEFORE-MAKE

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.4 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  1.21 mm