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FSA646UCX - onsemi

Description: CON: 1.5 pF Typical; OIRR: -24 dB Typical; MIPI, D-PHY; Xtalk: -30 dB Typical; RON_FLAT: 0.9 Ω Typical LP & HS MIPI; ICCZ:1 µA Maximum; 6 Ώ Typical LP MIPI; 6 Ώ Typical HS MIPI; Signal Types:; Switch Type: SPDT(10x); Skew of Opposite Transitions of the Same Output: 6 ps Typical; VCC: 1.5 to 5.0 V; Input Signals: 0 to 1.3 V; RON: ; △RON: 0.1 Ώ Typical LP & HS MIPI; Bandwidth: 2500 MHz Minimum; ICC: 15 µA Typical

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PCB Footprints
FSA646UCX - onsemi PCB footprint - BGA - BGA - WLCSP36 2.43x2.43x0.488
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3D Models
FSA646UCX - onsemi  - 3D model - BGA - WLCSP36 2.43x2.43x0.488
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FSA646UCX Details

  • Manufacturer Part Number:

    FSA646UCX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-36

  • Package Description:

    WLCSP-36

  • Manufacturer Package Code:

    567WJ

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    S-PBGA-B36

  • JESD-609 Code:

    e1

  • Length:

    2.43 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO/NC

  • Number of Channels:

    1

  • Number of Functions:

    10

  • Number of Terminals:

    36

  • Off-state Isolation-Nom:

    24 dB

  • On-state Resistance Match-Nom:

    0.1 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.526 mm

  • Supply Voltage-Max (Vsup):

    5 V

  • Supply Voltage-Min (Vsup):

    1.5 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    800 ns

  • Switch-on Time-Max:

    1100 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.43 mm

FSA646UCX Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FSA646UCX is -40°C to 125°C.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal design and layout guidelines, including providing adequate heat sinking and thermal management.
  • The recommended PCB layout and routing for the FSA646UCX involves following proper high-speed design guidelines, including using short, direct traces, and minimizing signal reflections and crosstalk.
  • To handle ESD protection for the FSA646UCX, it is recommended to follow proper ESD handling and protection guidelines, including using ESD-protective packaging, handling the device by the body, and using ESD-protective workstations.
  • The recommended power sequencing and voltage ramp-up times for the FSA646UCX are specified in the datasheet, and typically involve ramping up the voltage supply to the recommended operating voltage within 10-20 ms.

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